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Product Details for TCM - BF537
The TCM-BF537 is an ultra small Core Module designed for industrial temperature range and volume production. It combines Power Supply, RAM and FLASH into a module as small as a chip package. Two 60 pin expansion connectors allow quick prototyping. The module is also available with Border Pads (BP) or a Ball Grid Array (BGA) for low height integrations into the final product.
Features
CPU Analog Devices (R) ADSP-BF537 Blackfin Processor
CLOCK 500 MHz
CRYSTAL 25 MHz
RAM 32MB SDRAM
FLASH 8 MB
PPI 16Bit 1
SPI 1
UART 2
SPP 1
I2C 1
CAN 1
ETHERNET 10/100 MBit, external PHY required
TEMP. RANGE Extended temperature range : -40 to +85 °C
DIMENSIONS 28x28mm, 4 grams
ADITIONAL FEATURES

Single 3V3 Supply voltage
On-Board core voltage regulator
Low voltage reset circuit
2x 60 pin 0.6mm pitch connector

Border Pads (BP) or Ball Grid Array (BGA) versions available

RoHS RoHS compliant
BOOTLOADER BLACKSheep bootloader
Typical Applications
Industrial Automation & Control
Industrial Handheld Applications
Medium to High Volume Applications
Development Support
EVAL-BF5xx Evaluation Board
DEV-BF5xx Development Board
DEV-BF5xx-FPGA
BLACKSheep VDK Framework
uClinux Port available at blackfin.uclinux.org
LabVIEW embedded
Order No. Info Status
100-1225 TCM-BF537 Core processor module 500MHz with Connectors Available    prices    ordering
100-1226 TCM-BF537 Core processor module 500MHz with Border Pads (BP) Available    prices    ordering
100-1227 TCM-BF537 Core processor module 500MHz with Ball Grid Array (BGA) Samples available   


Check out the Ordering Information here

For prices please see our price list

Manuals & Datasheets

 ADSP_BF536_7_prd.pdf  last changed:27.2.2006
 TCM-BF537_HardwareUserManual_V1.pdf  last changed:28.3.2008
 TCM-BF537_Overview.pdf  last changed:21.2.2006
 TCM-BF537_Protel_Footprint.zip  last changed:1.2.2007
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